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Arihant Computers
MSI MEG X670E GODLIKE Motherboard - AM5, DDR5, PCIe 5.0, E-ATX
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The MSI MEG X670E GODLIKE Motherboard is a premium E-ATX motherboard designed for AMD's latest Ryzen 7000 Series processors. With cutting-edge features and an innovative design, it delivers exceptional performance for gamers and high-performance users.Key Features:
- Processor Compatibility: Supports AMD Ryzen™ 7000 Series desktop processors using the AM5 socket for powerful computing capabilities.
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Memory Support:
- Type: DDR5
- Slots: 4 DIMM slots
- Maximum Capacity: Up to 256GB
- Overclocking Capability: Supports speeds up to 8000+(OC) MHz for high-performance memory configurations.
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Expansion Slots:
- PCIe x16 Slots: 3 (PCIe 5.0)
- Multi-GPU Support: Compatible with AMD Multi-GPU setups.
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Storage Options:
- M.2 Slots: 4 (including one Gen5 x4 slot for ultra-fast NVMe SSDs)
- SATA III Ports: 8 for traditional storage solutions.
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Networking:
- LAN Controller: Marvell® AQC113-B1-C 10Gbps LAN for ultra-fast wired connectivity.
- Wi-Fi: Intel Wi-Fi 6E AX210 and Bluetooth 5.2 for high-speed wireless connections.
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Audio Features:
- Realtek® ALC4082 HD audio codec with ESS audio DAC for an immersive audio experience.
Advanced Features
- Extreme Power Design: Features a robust 24+2+1 phase power design with dual CPU power connectors and Smart Power Stage technology to unleash maximum performance.
- M-Vision Dashboard: A unique touchable 4.5-inch full-color IPS LCD that provides real-time monitoring and customization of system settings.
- Premium Thermal Module: Includes advanced cooling solutions such as a wavy fin design, Direct Touch Cross Heat-pipe, and Double-Sided M.2 Shield Frozr to ensure optimal thermal performance.
- Enhanced USB Connectivity: Multiple USB ports including USB Type-C for high-speed data transfer.
Design and Build Quality
The MEG X670E GODLIKE features a striking design with a black and gold aesthetic, complemented by a heavy heatsink for effective cooling. Its E-ATX form factor allows ample space for high-performance components while ensuring superior thermal management.
