MSI MPG X670E CARBON WIFI Motherboard - AM5, DDR5, PCIe 5.0, ATX

The MSI MPG X670E CARBON WIFI Motherboard is designed for high-performance gaming and computing, supporting AMD's latest Ryzen 7000 Series processors. With advanced features and a robust design, it provides an excellent foundation for gamers and PC enthusiasts.Key Features:

• Processor Compatibility:
  • Supports AMD Ryzen™ 9000, 8000, and 7000 Series Desktop Processors using the AM5 socket.
• Chipset:
  • AMD X670 chipset for enhanced performance and features.
• Memory Support:
  • Slots: 4 x DDR5 memory slots
  • Maximum Capacity: Up to 128GB
  • Speed Support:
    • Supports DDR5 speeds up to 6600+(OC) MHz for high-performance memory configurations.
• Expansion Slots:
  • PCIe Slots:
    • 2 x PCIe 5.0 x16 slots for graphics cards.
    • Enhanced SMT (Surface Mount Technology) design to reduce interference.
• Storage Options:
  • M.2 Slots:
    • 4 x M.2 slots (supports PCIe 5.0 and PCIe 4.0).
    • SATA Ports: 6 x SATA III (6Gb/s) ports for traditional storage solutions.
• Networking:
  • LAN Controller: Realtek® RTL8125BG (2.5Gbps) for reliable wired connectivity.
  • Wi-Fi: Integrated AMD Wi-Fi 6E solution with Bluetooth® 5.2 for fast wireless connections.
• Audio Features:
  • Realtek® ALC4080 Codec for high-definition audio quality with support for up to 8-channel audio.

Advanced Features

• Power Design:
  • Features an 18+2+1 Duet Rail Power System (DRPS) with dual power connectors to ensure stable power delivery during demanding tasks.
• Thermal Solutions:
  • Extended heatsink design with direct touch heat-pipe technology and M.2 Shield Frozr to maintain optimal temperatures during intense workloads.
• DIY Friendly Design:
  • Includes features like pre-installed I/O shield, EZ M.2 clips, and a Flash BIOS button for easy installation.

Design and Build Quality

The MPG X670E CARBON WIFI features a sleek black design with customizable RGB lighting, providing both aesthetic appeal and functionality. Its ATX form factor allows ample space for high-performance components while ensuring superior thermal management.