MSI MPG Z890 EDGE TI WIFI Motherboard - LGA 1851, DDR5, PCIe 5.0, ATX
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The MSI MPG Z890 EDGE TI WIFI Motherboard is a high-performance ATX motherboard designed for Intel's Core Ultra Processors (Series 2). With advanced features and robust connectivity options, it is ideal for gamers and PC enthusiasts seeking top-tier performance.Key Features:
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Processor Compatibility:
- Supports Intel® Core™ Ultra Processors (Series 2) using the LGA 1851 socket.
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Chipset:
- Intel Z890 chipset for enhanced performance and features.
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Memory Support:
- Slots: 4 x DDR5 UDIMM slots
- Maximum Capacity: Up to 256GB
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Speed Support:
- Supports DDR5 speeds up to 9200+(OC) MHz with Intel XMP 3.0 overclocking capabilities.
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Expansion Slots:
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PCIe Slots:
- 1 x PCIe 5.0 x16 slot for graphics cards
- Additional PCIe slots for expansion cards.
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PCIe Slots:
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Storage Options:
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M.2 Slots:
- 1 x Gen5 x4 (128Gbps) slot and multiple Gen4 x4 slots for high-speed NVMe SSDs.
- SATA Ports: Several SATA III (6Gb/s) ports for traditional storage solutions.
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M.2 Slots:
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Networking:
- LAN Controller: Intel Killer E5000B (5G LAN) for reliable wired connectivity.
- Wi-Fi: Integrated Wi-Fi 7 solution with Bluetooth® support for fast wireless connections.
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Audio Features:
- Realtek ALC1220P Codec providing high-definition audio quality with support for up to 7.1-channel audio.
Advanced Features
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Power Design:
- Features a robust power delivery system with a Duet Rail Power System (16+1+1+1 phases) and dual CPU power connectors for stable performance during demanding tasks.
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Thermal Solutions:
- Enlarged heatsinks with heat-pipe technology, MOSFET thermal pads rated at 7W/mK, and M.2 Shield Frozr to maintain optimal temperatures during intense workloads.
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EZ DIY Features:
- Includes pre-installed I/O shield, EZ M.2 Shield Frozr II, and EZ PCIe Release for easy installation.
Design and Build Quality
The MPG Z890 EDGE TI WIFI features a sleek silver-white color scheme that appeals to users looking to build aesthetically pleasing systems. Its robust design ensures durability while providing ample space for high-performance components.
