MSI PRO B760-P WIFI Motherboard - LGA 1700, DDR5, PCIe 4.0, ATX

The MSI PRO B760-P WIFI Motherboard is designed to support Intel's 12th and 13th Generation processors, providing a robust platform for both gaming and professional applications. This ATX motherboard features the Intel B760 chipset and is equipped with advanced connectivity options and high-performance features.Key Features:

• Processor Compatibility:
  • Supports Intel® Core™ 14th, 13th, and 12th Generation processors, as well as Pentium Gold and Celeron processors using the LGA 1700 socket.
• Chipset:
  • Intel B760 chipset for enhanced performance.
• Memory Support:
  • Slots: 4 x DDR5 DIMM slots
  • Maximum Capacity: Up to 256GB
  • Speed Support:
    • Supports DDR5 memory speeds up to 6800+ MHz (OC), with additional support for various lower frequencies (5600 MHz JEDEC).
• Expansion Slots:
  • PCIe Slots:
    • 1 x PCIe 4.0 x16 slot (from CPU)
    • Additional PCIe slots for expansion options.
• Storage Options:
  • M.2 Slots:
    • 2 x M.2 slots supporting PCIe Gen4 x4 for high-speed NVMe SSDs.
    • SATA Ports: 4 x SATA III (6Gb/s) ports for traditional storage solutions.
• Networking:
  • LAN Controller: Realtek® RTL8125BG with a 2.5Gbps LAN for reliable wired connectivity.
  • Wi-Fi: Integrated Wi-Fi 6E solution for fast wireless connections.
• Audio Features:
  • Realtek® ALC897 Codec providing high-definition audio quality with support for up to 7.1-channel audio.

Advanced Features

• Enhanced Power Design:
  • Features a robust power delivery system with a 12+1 Duet Rail Power System, dual CPU power connectors (8-pin + 4-pin), and Core Boost technology for improved performance.
• Premium Thermal Solution:
  • Includes extended heatsinks and MOSFET thermal pads rated at 7W/mK to ensure efficient cooling during intensive tasks.
• High Quality PCB Design:
  • Built with a six-layer PCB made from thickened copper for improved heat dissipation and reliability.

Design and Build Quality

The PRO B760-P WIFI features a durable ATX form factor that ensures efficient heat dissipation while providing ample space for high-performance components. Its robust construction guarantees stability and longevity in demanding environments.