MSI PRO B760M-A WIFI DDR4 Motherboard - LGA 1700, DDR4, PCIe 4.0, Micro-ATX

The MSI PRO B760M-A WIFI DDR4 Motherboard is designed for users looking to build a powerful and efficient system with Intel's latest processors. This Micro-ATX motherboard features the Intel B760 chipset and supports a variety of advanced features suitable for both gaming and productivity.Key Features:

• Processor Compatibility:
  • Supports Intel® Core™ 14th, 13th, and 12th Generation processors, as well as Pentium Gold and Celeron processors using the LGA 1700 socket.
• Chipset:
  • Intel B760 chipset for enhanced performance.
• Memory Support:
  • Slots: 4 x DDR4 DIMM slots
  • Maximum Capacity: Up to 128GB
  • Speed Support:
    • Supports DDR4 memory speeds up to 5333 MHz (OC) with various lower frequencies supported (3200 MHz JEDEC).
• Expansion Slots:
  • PCIe Slots:
    • 2 x PCIe 4.0 x16 slots (one from CPU, one from chipset)
    • 1 x PCIe 3.0 x1 slot.
• Storage Options:
  • M.2 Slots:
    • 2 x M.2 slots (1 supports PCIe Gen4 x4; the other supports both PCIe Gen4 x4 and SATA).
    • SATA Ports: 4 x SATA III (6Gb/s) ports for traditional storage solutions.
• Networking:
  • LAN Controller: Realtek® RTL8125BG with a 2.5Gbps LAN for reliable wired connectivity.
  • Wi-Fi: Integrated Intel® Wi-Fi 6E solution for fast wireless connections.
• Audio Features:
  • Realtek® ALC897 Codec providing high-definition audio quality with support for up to 7.1-channel audio.

Advanced Features

• Enhanced Power Design:
  • Features a robust power delivery system with a 12+1 Duet Rail Power System and dual CPU power connectors for optimal performance under load.
• Premium Thermal Solution:
  • Includes extended heatsinks and M.2 Shield Frozr technology to prevent thermal throttling during intensive workloads.
• High Quality PCB Design:
  • Built with a six-layer PCB made from thickened copper for improved heat dissipation and reliability.

Design and Build Quality

The PRO B760M-A WIFI features a durable Micro-ATX form factor that ensures efficient heat dissipation while providing ample space for high-performance components. Its robust construction guarantees stability and longevity in demanding environments.